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Module with adhesively attached heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Molded package for micromechanical devices and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Molded semiconductor power device having heat sinks exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip package having a contiguous heat spreader assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip press-connected type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-functional metal shield case and method for making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-lid semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multichip module, manufacturing method thereof, multichip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multilayer ceramic substrate with single via anchored pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multilayer printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multilayer printed wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multilayer substrate and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multilayer, high density micro circuit module and method of manu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Multiple integrated circuit die package with thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multiple semiconductor chip (multi-chip) module for use in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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