Multi-lid semiconductor package

Details Multi-lid semiconductor package Multi-lid semiconductor package

2008-05-02

2009-11-17

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S710000, C257S723000, C257S724000, C257S711000, C257S712000, C257SE23181

Reexamination Certificate

active

07619308

ABSTRACT:
A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more die and the corresponding die lid or lids, one or more substrate lids, and a substrate interface between the substrate and the corresponding substrate lid or lids. The multi-lid semiconductor package may include one or more discrete surface mount components disposed on the substrate. The multi-lid semiconductor package may include a sealant between the one or more die lids and the one or more substrate lids and the substrate. The one or more die lids and the one or more substrate lids may differ in construction, design, placement, and/or thermal performance.

REFERENCES:
patent: 6248959 (2001-06-01), Sylvester

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