Multilayer ceramic substrate with single via anchored pad...

Details Multilayer ceramic substrate with single via anchored pad... Multilayer ceramic substrate with single via anchored pad...

2006-01-17

2006-01-17

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S700000, C257S758000

Reexamination Certificate

active

06987316

ABSTRACT:
A multilayer ceramic substrate in which an outer metal pad is anchored to the substrate by a single metal-filled via in the first ceramic layer adjacent to the metal pad. In turn, this single metal-filled via is anchored to the substrate by a larger, single metal-filled via in the next ceramic layer adjacent to the first ceramic layer. Preferably, the metal-filled vias and metal pad are 100 volume percent metal.

REFERENCES:
patent: 4900878 (1990-02-01), Ichkhan
patent: 5706178 (1998-01-01), Barrow
patent: 5738530 (1998-04-01), Schreiber et al.
patent: 6096565 (2000-08-01), Goland et al.
patent: 6181016 (2001-01-01), Lin et al.
patent: 6187418 (2001-02-01), Fasano et al.
patent: 6252178 (2001-06-01), Hashemi
patent: 6312791 (2001-11-01), Fasano et al.
patent: 6361331 (2002-03-01), Fork et al.
patent: 6501186 (2002-12-01), Yu et al.
patent: 6551916 (2003-04-01), Lin et al.

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