Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1998-02-09
2000-01-18
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257700, 257706, 361749, 174256, H01L 2306, H01L 2310, H01L 2315
Patent
active
060160055
ABSTRACT:
A multilayer micro circuit module, and the method of manufacturing same, comprises a number of green sheets of ceramic material which are sintered before any other fabrication steps are undertaken. The sintered sheets are then formed with registration holes and via, and an electrically conductive pattern formed of a noble metal or copper is deposited onto one or both major surfaces of each sintered sheets. The sintered sheets are stacked one on top of the other to form a stack whose exterior surface is coated with a sealing material such as solder or glass and then fired at a temperature less than the melting point of a metal forming the conductive patterns so that the interior of the stack including the conductive patterns is substantially isolated from contaminants.
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Clark Jhihan B
Saadat Mahshid
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