Multilayer substrate and method of manufacturing the same

Details Multilayer substrate and method of manufacturing the same Multilayer substrate and method of manufacturing the same

2007-09-25

2010-11-16

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S701000, C257S778000, C257SE23173

Reexamination Certificate

active

07834441

ABSTRACT:
A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

REFERENCES:
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5565706 (1996-10-01), Miura et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5994648 (1999-11-01), Glovatsky et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6359235 (2002-03-01), Hayashi
patent: 6680441 (2004-01-01), Kondo et al.
patent: 7165321 (2007-01-01), Kondo et al.
patent: 7420273 (2008-09-01), Liu et al.
patent: 2006/0042078 (2006-03-01), Takeuchi et al.
patent: 2006/0154496 (2006-07-01), Imamura et al.
patent: A-2005-142178 (2005-06-01), None
Office action dated Mar. 27, 2009 issued from the Chinese Patent Office for counterpart application No. 2007101817912 (English translation enclosed).
Office Action mailed Feb. 10, 2010 from German Patent Office in corresponding DE Application No. 10 2007 058 555.3-34 (and English translation).

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