Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

1994-12-05

1996-01-09

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257702, 257723, 361750, H01L 2312

Patent

active

054831016

ABSTRACT:
A semiconductor package applicable to integrated circuits and other semiconductor devices of the kind needing high integration and high speed operation. The package has a printed circuit board implemented by a glass cloth impregnated with epoxy, bismaleimide-triazine (BT) or similar resin, a power source layer provided in the circuit board in a plate structure, a ground layer formed on the surface of the circuit board in a plate structure, and a thin film laminate wiring formed on the ground layer in a plate structure and consisting of copper and benzocyclobutene. The package desirably shields leakage currents and matches a characteristic impedance with accuracy, thereby noticeably reducing noise and enhancing high speed signal transmission.

REFERENCES:
patent: 4526835 (1985-07-01), Takahashi et al.
patent: 5137618 (1992-08-01), Burnett et al.

Affiliated with

Also associated with

Rating

Multilayer printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1304340