Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-11-27
2009-02-24
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S758000, C257S774000, C257S787000, C257SE23062
Reexamination Certificate
active
07495332
ABSTRACT:
A multilayer printed wiring board is equipped with a core board20, a build-up layer30formed on the core board20so as to have a conductor pattern32on the upper surface thereof, a low-elasticity layer40formed on the build-up layer30, lands52that are provided on the upper surface of the low-elasticity layer40and connected to an IC chip70via solder bumps66, and conductor posts50that penetrate through the low-elasticity layer40and electrically connect the lands52to the conductor pattern32. The low-elasticity layer40is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.
REFERENCES:
patent: 6770965 (2004-08-01), Takeuchi et al.
patent: 6909054 (2005-06-01), Sakamoto et al.
patent: 6939738 (2005-09-01), Nakatani et al.
patent: 2002/0076539 (2002-06-01), Nakamura et al.
patent: 2006/0180341 (2006-08-01), Kariya et al.
patent: 2006/0231290 (2006-10-01), Kariya et al.
patent: 0 805 614 (1997-11-01), None
patent: 0 805 614 (1997-11-01), None
patent: 58-28848 (1983-02-01), None
patent: 05-37157 (1993-02-01), None
patent: 11-17346 (1999-01-01), None
patent: 2001-36253 (2001-02-01), None
patent: 2001-288336 (2001-10-01), None
patent: 2001-298272 (2001-10-01), None
patent: 1999-0067668 (1999-08-01), None
U.S. Appl. No. 11/415,117, filed May 2, 2006, Kariya et al.
U.S. Appl. No. 11/563,355, filed Nov. 27, 2006, Kariya et al.
Furutani Toshiki
Goto Hirofumi
Iwanaga Shin-ichiro
Kariya Takashi
Ibiden Co. Ltd.
JSR Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Parekh Nitin
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