LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic part unit attached to a circuit board and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic part with groove in lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic parts packaging structure and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Embedded heat spreader ball grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulated component and method for the production thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulated microelectromechanical (MEMS) devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulation of a device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulation of electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulation of electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced BGA grounded heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced chip scale package for flip chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced die-up ball grid array packages and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced heat dissipating chip scale package method and devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced thermal dissipation integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Exposed die-attach heatsink package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Exposed heat spreader with seal ring