Encapsulation of a device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S088000, C257S098000, C257S099000, C257S100000, C313S504000, C313S512000

Reexamination Certificate

active

06888237

ABSTRACT:
An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

REFERENCES:
patent: 4287285 (1981-09-01), Mosehauer
patent: 4501637 (1985-02-01), Mitchell et al.
patent: 4720432 (1988-01-01), VanSlyke et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4767679 (1988-08-01), Kawachi
patent: 5022554 (1991-06-01), Heeter et al.
patent: 5408109 (1995-04-01), Heeger et al.
patent: 5693956 (1997-12-01), Shi et al.
patent: 5781169 (1998-07-01), Kuijk et al.
patent: 5804917 (1998-09-01), Takahashi et al.
patent: 5844363 (1998-12-01), Gu et al.
patent: 6069443 (2000-05-01), Jones et al.
patent: 6175186 (2001-01-01), Matsuura et al.
patent: 6198217 (2001-03-01), Suzuki et al.
patent: 6268695 (2001-07-01), Affinito
patent: 6278237 (2001-08-01), Campos
patent: 6309901 (2001-10-01), Tahon et al.
patent: 6592969 (2003-07-01), Burroughs et al.
patent: 6600175 (2003-07-01), Baretz et al.
patent: 2 585 510 (1987-01-01), None
patent: 2 028 719 (1990-03-01), None
patent: 58-39075 (1983-03-01), None
patent: 155504 (1991-04-01), None
patent: WO0104938 (2001-01-01), None
patent: WO 0105205 (2001-01-01), None
J.H. Burroughes et, al, NATURE: “Light-emitting diodes based on conjugated polymers”, Oct. 11, 1990, vol. 347, pp. 539-541.
Harper, Charles A., “Electronics Packaging and Interconnection Handbook, 1991,” McGraw-Hill, Inc., pp. 1.22-1.23, 1.40-1.42.

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