Encapsulation of a device

Details Encapsulation of a device Encapsulation of a device

2005-05-03

2005-05-03

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S088000, C257S098000, C257S099000, C257S100000, C313S504000, C313S512000

Reexamination Certificate

active

06888237

ABSTRACT:
An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

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