Encapsulation of electronic devices

Details Encapsulation of electronic devices Encapsulation of electronic devices

2008-07-01

2008-07-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S710000, C257S667000, C257S783000, C257S773000, C257SE33058, C257SE23193

Reexamination Certificate

active

07394153

ABSTRACT:
An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

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