LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic substrate for semiconductor fabricating device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic substrate for semiconductor production and inspection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chain extension for thermal materials

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip assembly with load-bearing lid in thermal contact with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip bead element and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip carrier for enabling production of high performance microwa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip cooling channels formed in wafer bonding gap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip module for complete power train

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip on board with heat sink attachment and assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip package structure with dual heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip packaging system and method using deposited diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip type varistor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-scale packaged pressure sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-size integrated circuit package having slits formed in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-type electronic component having external electrodes...