Chip bead element and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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257702, 333174, H01L 23053, H01L 2312, H03H 700

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active

06028353&

ABSTRACT:
The present invention relates to a laminated chip bead element demonstrating noise absorption characteristics over a broad range in a high frequency range of GHz or higher. An insulating body is constituted of a material achieved by mixing ferrite powder and an insulating resin. At least one signal conductor is embedded in the insulating body. It is desirable that the insulating body includes a plurality of composite members.

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patent: 5748065 (1998-05-01), Hashimoto et al.
P.Schiffres, "Dissipative Coaxial RFI Filter", IEEE Transactions on Electromagnetic Compatibility, EMC-6, (1964), pp. 55-61.
H.M. Schlicke, et al., "Compatible EMI Filters", IEEE Spectrum, Oct. 1967, pp. 59-68.
J. H. Bogar, et al., "Miniature Low-Pass EMI Filters", Proceedings of the IEEE, vol. 67, No. 1, Jan. 1979, pp. 159-163.

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