LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated,With specified encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electronic assemblies containing bow resistant semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electronic circuit unit that is easy to manufacture and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electronic coatings

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electronic device and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electronic device and optical transmission module

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Electrophoretic coating methodology to improve internal package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Embedded chip enclosure with solder-free interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulant for microelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulant for opto-electronic devices and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulant method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulant with fluxing properties and method of use in...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulated chip module and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulated semiconductor device having metal foil covering, an

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulated sensor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulation of thin-film electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Encapsulation of thin-film electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Enhancement of underfill physical properties by the addition...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Epoxy polymer filled with aluminum nitride-containing polymer an

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Epoxy resin composition for encapsulating semiconductor...