Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1997-12-08
2000-04-04
Monin, Jr., Donald L.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257787, 438124, 438126, 438127, H01L 2348
Patent
active
060465077
ABSTRACT:
Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The principles of the present invention contemplate electrostatically depositing an exceptionally uniform coating on electronic components, especially microchips, and more especially still, on integrated circuits prior to the encapsulation of the electronic components into plastic-packaged components. The coating, for instance applied to a completed leadframe assembly, including die and wire bonds, serves two purposes. It improves adhesion of the molding compound forming the package, thereby reducing the chances for delamination of the package. The coating also isolates the relatively fragile wire bonds, including their attachment points to the chip and the bonding pads and the leads, from chemical and metallurgical attack by the flame retardant found in many molding compounds.
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Robert Kessel, "Taking a Look at a New Topcoat Technology", Home Lighting & Accessories, Clifton, NJ, (printing date unknown).
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UDYLITE.RTM. Technical Data Sheet, .COPYRGT. 1994, Enthone-OMI Inc., pp. 1-12 (minus p. 11, which is a page for taking notes).
Blish II Richard C.
Hatchard Colin D.
Advanced Micro Devices
Dietrich Michael
Monin, Jr. Donald L.
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