Electronic device and method of fabricating the same

Details Electronic device and method of fabricating the same Electronic device and method of fabricating the same

2005-12-22

2010-10-19

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S660000, C257S778000, C257S783000, C257S787000, C257S788000, C438S108000, C438S110000, C438S127000

Reexamination Certificate

active

07816794

ABSTRACT:
An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

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Office Action dated Jul. 14, 2009, 4 pages.

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