Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2005-10-18
2005-10-18
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S787000, C257S788000, C257S793000, C257S723000, C257S724000
Reexamination Certificate
active
06956297
ABSTRACT:
An electronic circuit unit includes a substrate on which a wiring pattern is provided; electronic parts, including a semiconductor bare chip disposed on a surface of the substrate; and a soft sealing resin provided on the substrate so as to cover the electronic parts. A wire of the semiconductor bare chip is connected to the wiring pattern and is covered with the soft sealing resin and a protection member made of a resin harder than the sealing resin having an upper wall having a flat external surface and leg parts extending from the upper wall to the substrate. Since the leg parts are secured to the substrate while the protection member covers the sealing resin, the protection member can protect the sealing resin without being cracked even when external force is applied to the protection member, thereby preventing the wire from breaking.
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Alps Electric Co. ,Ltd.
Brinks Hofer Gilson & Lione
Clark Jasmine
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