FBGA arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

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Details

C257S781000, C257S784000, C257S787000, C257S738000, C438S015000, C438S019000, C438S100000, C438S106000, C438S127000

Reexamination Certificate

active

07023097

ABSTRACT:
The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands (landing pads) on the substrate by a bonding channel in the substrate via wire bridges, which substrate, for its part, is provided with soldering balls—arranged in an array—for contact connection to a printed circuit board, and the contact islands and the soldering balls being connected to one another via a rewiring of the substrate. The preferred embodiment of the invention is intended to provide an FBGA arrangement which supports the center pad row technology and at the same time has low electrical parasitics. This is achieved by virtue of the fact that at least two substrates (1, 2) are provided, the substrates (1, 2) are provided substratewise in each case with bonding channels (3, 4) having different dimensions, in a manner forming a multistage bonding channel, the bonding channels (3) in the ball-side substrate (2) having larger dimensions than those in the chip-side substrate (1).

REFERENCES:
patent: 6049129 (2000-04-01), Yew et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6278616 (2001-08-01), Gelsomini et al.
patent: 6706564 (2004-03-01), Kim et al.
patent: 2003/0214047 (2003-11-01), Noguchi

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