Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2008-02-26
2009-12-29
Pert, Evan (Department: 4148)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S787000, C257SE23024, C257SE21502, C438S119000
Reexamination Certificate
active
07638885
ABSTRACT:
A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved.
REFERENCES:
patent: 2006/0289469 (2006-12-01), Chandra et al.
Kim Hyejung
Kim Yongsang
Yoo Hoi-Jun
Korea Advanced Institute of Science & Technology
Moore Whitney
Negrin Barry E.
Pert Evan
Pryor Cashman LLP
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