Adhesive tape and semiconductor package using the same

Details Adhesive tape and semiconductor package using the same Adhesive tape and semiconductor package using the same

2011-08-16

2011-08-16

Clark, Sheila V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S668000

Reexamination Certificate

active

07999396

ABSTRACT:
Provided is an adhesive tape which adheres two members to each other and decreases problems that may occur due to contraction and expansion of the adhered members when the temperature of the adhered two members changes. The adhesive tape includes: a base film having insulating properties; and an adhesive agent that adheres on both sides of the base film, wherein a coefficient of thermal expansion of the base film is 10 ppm or lower, a coefficient of thermal expansion of the adhesive tape is lower than 17 ppm, and an occupation rate of the base film in the adhesive tape exceeds 50%.

REFERENCES:
patent: 6455354 (2002-09-01), Jiang
patent: 6541872 (2003-04-01), Schrock et al.
patent: 2002/0192859 (2002-12-01), Akram
patent: 2005/0253241 (2005-11-01), Hall
patent: 2005/0255612 (2005-11-01), Jiang et al.
patent: 2006/0284319 (2006-12-01), Jiang
patent: 2007/0194415 (2007-08-01), Seng et al.
patent: 8-083818 (1996-03-01), None
patent: 10-2002-0079703 (2002-10-01), None
patent: 10-0492491 (2005-05-01), None

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