Attachment of ceramic chip carriers to printed circuit boards

Details Attachment of ceramic chip carriers to printed circuit boards Attachment of ceramic chip carriers to printed circuit boards

1995-03-22

1997-06-24

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257690, 257700, H01L 2348, H01L 2352

Patent

active

056419953

ABSTRACT:
A leadless chip carrier is attached to a printed circuit board by soldering its input-output connections to the printed circuit board and also by providing an adhesive between a central portion of the leadless chip carrier and the printed circuit board. This adhesive provides increased mechanical strength to the connection, improving its tolerance to temperature cycling. The adhesive used may be the same solder used to make the input-output connections.

REFERENCES:
patent: 5218234 (1993-06-01), Thompson et al.
"Electronic Packaging and Interconnection Handbook", pp. 7.24-7.25, Harper.
Semiconductor International by Ron Iscoff, West Coast Editor, Will Hybrid Circuits Survive?, Oct. 1993 issue, pp. 56-59.
Electronic Materials Handbook -- vol. 1 "Packaging" by ASM International, Materials Park, OH, 1989: 0-89170-285-1 at p. 205, 651-657.
Market Trends by E. Jan, Emerging Flip Chip Use, Fall 1993 issue, pp. 32-34 .

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