Attachment system and method therefor

Details Attachment system and method therefor Attachment system and method therefor

1997-03-31

1998-10-20

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257781, 257783, 438612, H01L 2348, H01L 2352, H01L 2940

Patent

active

058250930

ABSTRACT:
An attachment system (10,30) for electronic devices utilizes an interconnect substrate (11) and an attachment area (12,32) formed thereon. A non-wettable material (16,36) on a surface (13) of the substrate (11) substantially prevents an attachment material (17) from forming stress or cracks in the substrate (11).

REFERENCES:
patent: 5220200 (1993-06-01), Blanton
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5376584 (1994-12-01), Agarwala
"Physical Design and Assembly Process Development of a Multi-chip Package Containing a Light Emitting Diode (LED) Array Die" by Rao Bonda, Treliant Fang, Ken Kaskoun, Bill Lytle, Geoff Swan, John W. Stafford; 1996 Electronic components & Technology Conference; Chapter 19, pp. 1039-1046.

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