Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1997-04-22
1999-04-06
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257787, 257778, H01L 2348, H01L 2352, H01L 2940
Patent
active
058922890
ABSTRACT:
A mounting structure is provided which improves the reliability of the connection between the bumps at the four corners of a flip-chip mounted semiconductor chip which is subject to stress concentrations caused by board warping or a difference in thermal coefficient of expansion when subjecting the mounted chip to thermal cycling tests. In this structure, a sealing resin is caused to flow into a space between the semiconductor chip and the board at the four corners of the semiconductor chip, thereby forming large resin fillets at the four corners, these fillets relieving the above-noted stress at the bump connection parts of the four corners of the semiconductor chip, thereby causing an improvement in reliability of the connection. The flowing distance is shortened and simultaneous flowing resin is performed, thereby shortening the time required for sealing.
REFERENCES:
patent: 5616958 (1997-04-01), Laire
patent: 5629566 (1997-05-01), Doi et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5670826 (1997-09-01), Bessho et al.
Clark S. V.
NEC Corporation
Saadat Mahshid
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