Structures and methods for reduction of parasitic...

Structures and methods to enhance copper metallization

Structures and methods to enhance copper metallization

Stud-cone bump for probe tips used in known good die carriers

Sub-cap and method of manufacture therefor in integrated...

Sub-half-micron multi-level interconnection structure and proces

Sub-lithographic feature patterning using self-aligned...

Sub-lithographic nano interconnect structures, and method...

Sub-milliohm on-chip interconnection

Sub-milliohm on-chip interconnection

Sub-minimum wiring structure

Sub-quarter-micron copper interconnections with improved electro

Sub-quarter-micron copper interconnections with improved...

Sublithographic patterning using microtrenching

Submicron contact fill using a CVD TiN barrier and high...

Submicron metallization using electrochemical deposition

Substantially planar semiconductor topography using...

Substituted phenylethylene precursor deposition method

Substrate and manufacturing method of the same

Substrate carrier having a streamlined shape and method for thin