Shapes-based migration of aluminum designs to copper damascence
Shapes-based migration of aluminum designs to copper damascene
Shrinking contact apertures through LPD oxide
Shrinking contact apertures through LPD oxide
Si seasoning to reduce particles, extend clean frequency,...
Si seasoning to reduce particles, extend clean frequency,...
Si-rich surface layer capped diffusion barriers
Side wall passivation films for damascene cu/low k...
Sidewall coverage for copper damascene filling
Sidewall protection for a via hole formed in a...
Sidewall sealing of porous dielectric materials
Sidewall spacer structure for self-aligned contact and...
Sidewall treatment for low dielectric constant (low K)...
Sidewalls for guiding the via etch
SiH 4 soak for low hydrogen SiN deposition to improve flash...
Silicide and salicide on the same chip
Silicide block bounded device
Silicide encapsulation of polysilicon gate and interconnect
Silicide gate field effect transistors and methods for...
Silicide gate transistors