Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-12-25
2007-12-25
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21575
Reexamination Certificate
active
11256025
ABSTRACT:
An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.
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Dunham Timothy G.
Hall Ezra D. B.
Landis Howard S.
Lavin Mark A.
Leipold William C.
Geyer Scott B.
Schmeiser Olsen & Watts
Steinberg William H.
Ullah Elias
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