Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-31
2006-01-31
Thomas, Tom (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S631000, C438S633000, C438S637000
Reexamination Certificate
active
06992002
ABSTRACT:
An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.
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Dunham Timothy G.
Hall Ezra D. B.
Landis Howard S.
Lavin Mark A.
Leipold William C.
Richards N. Drew
Schmeiser Olsen & Watts
Steinberg William H.
Thomas Tom
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