Structure of semiconductor electronic device and method of...

Structure of UBM and solder bumps and methods of fabrication

Structure to facilitate plating into high aspect ratio vias

Structures and methods for an application of a flexible bridge

Structures and methods for improving solder bump connections...

Structures and methods for improving solder bump connections...

Structures and methods for reduction of parasitic...

Structures and methods to enhance copper metallization

Structures and methods to enhance copper metallization

Stud-cone bump for probe tips used in known good die carriers

Sub-cap and method of manufacture therefor in integrated...

Sub-half-micron multi-level interconnection structure and proces

Sub-lithographic feature patterning using self-aligned...

Sub-lithographic nano interconnect structures, and method...

Sub-milliohm on-chip interconnection

Sub-milliohm on-chip interconnection

Sub-minimum wiring structure

Sub-quarter-micron copper interconnections with improved electro

Sub-quarter-micron copper interconnections with improved...

Sublithographic patterning using microtrenching