Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-07-26
2011-07-26
Brewster, William M (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S012000, C438S013000, C438S106000, C438S754000, C438S612000, C438S613000, C438S614000, C257S779000, C257S737000, C257SE23069, C257S738000
Reexamination Certificate
active
07985671
ABSTRACT:
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The method includes forming an upper wiring layer in a dielectric layer and depositing one or more dielectric layers on the upper wiring layer. The method further includes forming a plurality of discrete trenches in the one or more dielectric layers extending to the upper wiring layer. The method further includes depositing a ball limiting metallurgy or under bump metallurgy in the plurality of discrete trenches to form discrete metal islands in contact with the upper wring layer. A solder bump is formed in electrical connection to the plurality of the discrete metal islands.
REFERENCES:
patent: 6426557 (2002-07-01), Daubenspeck et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6622907 (2003-09-01), Fanti et al.
patent: 6825541 (2004-11-01), Huang et al.
patent: 7033923 (2006-04-01), Seshan
patent: 7034402 (2006-04-01), Seshan
patent: 7049171 (2006-05-01), Brauer
patent: 7176583 (2007-02-01), Daubenspeck et al.
patent: 2005/0093113 (2005-05-01), Lin et al.
patent: 2006/0131748 (2006-06-01), Seshan
Daubenspeck Timothy H.
Gambino Jeffrey P.
Muzzy Christopher D.
Sauter Wolfgang
Sullivan Timothy D.
Baptiste Wilner Jean
Brewster William M
International Business Machines - Corporation
Kotulak Richard
Roberts Mlotkowski Safran & Cole P.C.
LandOfFree
Structures and methods for improving solder bump connections... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structures and methods for improving solder bump connections..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structures and methods for improving solder bump connections... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2725781