Reinforced integrated circuits
Reinforced solder bump structure and method for forming a...
Reliability barrier integration for Cu application
Reliable BEOL integration process with direct CMP of porous...
Reliable interconnect via structures and methods for making the
Reliable interconnect via structures and methods for making the
Reliable interconnects with low via/contact resistance
Reliable low-k interconnect structure with hybrid dielectric
Reliable metal bumps on top of I/O pads after removal of...
Reliable metal bumps on top of I/O pads after removal of...
Removal of dielectric oxides
Removal of metal cusp for improved contact fill
Removal of metal cusp for improved contact fill
Removal of metal veils from via holes
Removal of residue from a substrate
Removal of SiON residue after CMP
Removing sacrificial material by thermal decomposition
Repair of dielectric-coated electrode or circuit defects
Repairing method for low-k dielectric materials
Residue-free contact openings and methods for fabricating same