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SOI wafer with cooling channels and a method of manufacture...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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SOI wafer with cooling channels and a method of manufacture...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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SOI wafers and methods for producing SOI wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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SOI wafers with 30-100 Å buried oxide (BOX) created...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Solid-state imaging device and method for manufacturing the...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Solid-state imaging device and method for manufacturing the...

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Stacked semiconductor chips

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Stacked-substrate processes for production of nitride...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
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Stacking memory chips using flat lead-frame with breakaway...

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Storage structure with cleaved layer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Strain-direct-on-insulator (SDOI) substrate and method of...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Strained semiconductor by wafer bonding with misorientation

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
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Stress control of thin films by mechanical deformation of wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
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Stress control of thin films by mechanical deformation of...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
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Stress-free silicon wafer and a die or chip made therefrom

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Structure and fabrication process of silicon on insulator wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Structure and method of integrating compound and elemental...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Structure and method of manufacturing the same

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Structure combining an IC integrated substrate and a...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Structure comprising a thin layer of material made up of...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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