Structure and method of manufacturing the same

Details Structure and method of manufacturing the same Structure and method of manufacturing the same

2007-02-20

2007-02-20

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S782000, C257SE21568

Reexamination Certificate

active

10964614

ABSTRACT:
A method of manufacturing a structure in which a substrate can be removed easily from a structure that has been formed on the substrate by using a film forming technology. The method of manufacturing a structure includes the steps of (a) forming an intermediate layer on a substrate; (b) forming a structure including a brittle material layer on the intermediate layer by at least using a spray deposition method of spraying material powder toward the substrate, on which the intermediate layer is formed, to deposit the material powder; and (c) removing the substrate from the structure.

REFERENCES:
patent: 5203944 (1993-04-01), Prinz et al.
patent: 6523236 (2003-02-01), Nishikawa et al.
patent: 2005/0046312 (2005-03-01), Miyoshi
patent: 2003-34003 (2003-02-01), None
patent: 2003-215256 (2003-07-01), None

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