I.sup.2 L heterostructure bipolar transistors and method of maki

IC chemical mechanical planarization process incorporating slurr

II-IV group compound crystal article and process for producing s

III(A)-(VB) Type luminescent diode

III-V Compound heteroepitaxial 3-D semiconductor structures util

III-V on Si heterostructure using a thermal strain layer

Immersion member for hot dip galvanizing bath and method for pre

Impact sound stressing for semiconductor devices

Impermeable electroform for hot isostatic pressing

Implantation of an insulative layer

Implantation profile control with surface sputtering

Implanting yttrium and oxygen ions at semiconductor/insulator in

Improved copper base alloys

Improved process to form bucket brigade device

Improving the electrical conductivity of aluminum alloys through

Impurity reduction technique for mercury cadmium telluride

Impurity-induced seeding of polycrystalline semiconductors

In situ interlayer formation for transient liquid phase diffusio

In-line heat treatment of hot-rolled rod

In-line method of making heat-treated and annealed aluminum...