IC chemical mechanical planarization process incorporating slurr

Details IC chemical mechanical planarization process incorporating slurr IC chemical mechanical planarization process incorporating slurr

1992-12-23

1994-04-05

Chaudhuri, Olik

Metal treatment

Barrier layer stock material, p-n type

437228, 437248, 156636, H01L 2900

Patent

active

053001559

ABSTRACT:
An IC chemical mechanical planarization (cmp) process incorporating slurry temperature control. Specifically, there is a VCMP process which requires small holders 18. The VCMP process incorporates small quantities of chemicals in the holder, and utilizes a system of closely regulating the heating and cooling of the chemical component of the VCMP process to increase and decrease the chemical reaction, and therefore the speed of the chemical removal of tungsten material.

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patent: 4992135 (1991-02-01), Doan
patent: 5104828 (1992-04-01), Morimoto et al.

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