LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package and process for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package comprising a heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Ball grid array package construction with raised solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array package construction with raised solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package employing raised metal contact rings

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Ball grid array package employing solid core solder balls

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Ball grid array package emulator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package enhanced with a thermal and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package enhanced with a thermal and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package for a integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Ball grid array package for enhanced stress tolerance

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Ball grid array package for high speed devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Ball grid array package for providing constant internal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package having a deformable metal layer and meth

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package having electrodes on peripheral side sur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package having one or more stiffeners

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package having testing capability after...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Ball grid array package having through-holes disposed in the sub

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package semiconductor device having improved...