Ball grid array package employing solid core solder balls

Details Ball grid array package employing solid core solder balls Ball grid array package employing solid core solder balls

1997-04-21

1998-11-24

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257738, 257778, 257779, H01L 2348, H01L 2352, H01L 2940

Patent

active

058411984

ABSTRACT:
A ball grid array package utilizes solder balls having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard assembly are heated to the melting point of the solder material, the cores remain solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder from being squashed and flowing to adjacent ball contacts.

REFERENCES:
patent: 2934685 (1960-04-01), Jones
patent: 3496428 (1970-02-01), Volder
patent: 3809625 (1974-05-01), Brown et al.
patent: 4600600 (1986-07-01), Pammer et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5468995 (1995-11-01), Higgins, III
patent: 5506756 (1996-04-01), Haley
patent: 5640052 (1997-06-01), Tsukamoto
"Multi-Layer Tab Tape Having Distinct Signal, Power and Ground Planes, Semiconductor Device Assembly Employing Same, Apparatus for and Method of Assembling Same," U.S. Patent Application Serial No. 08/625,641 filed Mar. 29, 1996.

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