Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-09-20
2005-09-20
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S528000, C257S774000
Reexamination Certificate
active
06946733
ABSTRACT:
A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.
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Bloom Terry R.
Cooper Richard
Poole David
Andújar Leonardo
Bourgeois Mark P.
CTS Corporation
Deneufbourg Daniel J.
Flynn Nathan J.
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