Ball grid array package and process for manufacturing same

Details Ball grid array package and process for manufacturing same Ball grid array package and process for manufacturing same

2008-05-13

2008-05-13

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257S780000, C257SE23069

Reexamination Certificate

active

07372151

ABSTRACT:
A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conductive traces of the substrate. The semiconductor die and the solder balls are encapsulated in an overmold material on the substrate such that portions of the solder balls are exposed. A ball grid array is formed such that bumps of the ball grid array are electrically connected to the conductive traces and the integrated circuit package is singulated.

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U.S. Appl. No. 10/323,657, Chun Ho Fan et al., “Process for Manufacturing Ball Grid Array Package”, filed Dec. 20, 2002.
U.S. Appl. No. 10/643,961, Chun Ho Fan et al., “Improved Ball Grid Array Package and Process for Manufacturing Same”, filed Aug. 20, 2003.
U.S. Appl. 10/647,696, Mohan Kirloskar et al., “Improved Ball Grid Array Package and Process for Manufacturing Same”, filed Aug. 25, 2003.

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