4. Active solid-state devices (e.g., transistors, solid-state diode
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Wafer-level chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer-level coated copper stud bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer-level diamond spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Wafer-level diamond spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Wafer-level electronic modules with integral connector contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Wafer-level moat structures

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
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Wafer-level package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Wafer-level package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Wafer-level package having test terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Wafer-level package having test terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Wafer-level package having test terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Wafer-level package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer-level package with a cavity and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
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Wafer-level package with silicon gasket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Wafer-level package with test terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Wafer-level packaging of optoelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Wafer-level seal for non-silicon-based devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer-level sealed microdevice having trench isolation and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
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Wafer-level solder bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Wafer-level testing apparatus and method

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
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