Wafer-level packaging of optoelectronic devices

Details Wafer-level packaging of optoelectronic devices Wafer-level packaging of optoelectronic devices

2005-10-11

2005-10-11

Abraham, Fetsum (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S704000, C257S778000, C257S779000

Reexamination Certificate

active

06953990

ABSTRACT:
A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

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