4. Active solid-state devices (e.g., transistors, solid-state diode
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Underfill coating for LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Underfill dispensing system for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Underfill for light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Underfill integration for optical packages

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Underfill material to reduce ball limiting metallurgy...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Underfill of a bumped or raised die utilizing a barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Underfill of a bumped or raised die utilizing a barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Underfill of a bumped or raised die utilizing barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Underfill of bumped or raised die using a barrier adjacent to th

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Underfill of chip-under-chip semiconductor modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Underfilled, encapsulated semiconductor die assemblies and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Underfilling process in a molded matrix array package using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Underfilling process in a molded matrix array package using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Underlayer for high performance magnetic tunneling junction...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Undoped oxide liner/BPSG for improved data retention

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Undoped polysilicon as the floating-gate of a split-gate...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Undoped polysilicon gate process for NMOS ESD protection circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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