Underfill for light emitting device

Details Underfill for light emitting device Underfill for light emitting device

2006-09-12

2010-11-30

Pham, Hoai v (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S783000, C257SE23040

Reexamination Certificate

active

07843074

ABSTRACT:
A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.

REFERENCES:
patent: 5780321 (1998-07-01), Shieh et al.
patent: 6049124 (2000-04-01), Raiser et al.
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6964877 (2005-11-01), Chen et al.
patent: 7078319 (2006-07-01), Eliashevich et al.
patent: 2005/0023550 (2005-02-01), Eliashevich et al.
patent: 2005/0025435 (2005-02-01), Miyamae
patent: 2006/0030125 (2006-02-01), Sackrison et al.
patent: 2006/0091409 (2006-05-01), Epler et al.
patent: 2008/0113460 (2008-05-01), Shelton et al.
Miskys et al., Freestanding GaN-substrates and devices, phys. stat. sol. (c) 0, No. 6, 1627-1650 (2003).

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