Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2011-08-02
2011-08-02
Smith, Matthew (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257SE21502, C438S127000, C438S055000, C118S052000, C029S841000
Reexamination Certificate
active
07989965
ABSTRACT:
A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate.
REFERENCES:
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5906682 (1999-05-01), Bouras et al.
patent: 6895666 (2005-05-01), Hong et al.
Chao-Ming Lin, Enhancement of Underfill Capillary Flow in Flip-Chip Packaging by Means of the Inertia Effect, IEEE Transactions on Advanced Packaging, Aug. 2004, p. 533-539, vol. 27, Issue 3.
Lee Yit Meng
Manikam Vemal Raja
Manikam Vittal Raja
Bergere Charles
Freescale Semiconductor Inc.
Smith Matthew
Swanson Walter H
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