4. Active solid-state devices (e.g., transistors, solid-state diode
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Stacked micro optocouplers and methods of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead
Reexamination Certificate

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Stacked microelectronic assemblies and methods of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked microelectronic assemblies with central contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked microelectronic assembly and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stacked microelectronic assembly and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked microelectronic device assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked microelectronic devices and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked microelectronic dies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked microelectronic packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked MIMCap between Cu dual damascene levels

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Stacked module package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked multi-chip modules using C4 interconnect technology...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Stacked multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked multi-chip package, process for fabrication of chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked multi-chip semiconductor package improving...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked multi-component integrated circuit microprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked multilayer structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Stacked multiple photosensor structure including independent...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Stacked multiple quantum well superlattice infrared detector

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction
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Stacked multiple-chip module micro ball grid array packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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