Stacked multi-component integrated circuit microprocessor

Details Stacked multi-component integrated circuit microprocessor Stacked multi-component integrated circuit microprocessor

2006-04-11

2006-04-11

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S723000, C257S724000, C257S778000, C257S780000, C257S784000

Reexamination Certificate

active

07026718

ABSTRACT:
An apparatus and method for fabricating-a microprocessor comprising a first chip (12) having an active face (30) including a central processing unit and a second chip (14) having an active face (32) electrically connected to the active face of the first chip (12), wherein the second chip (14) provides added functionality to the central processing unit of the first chip (12) and wherein the electrical connections (16, 18) are through bonding layers (28) that are in contact with the metalization26on the first and second chips (12, 14), is disclosed.

REFERENCES:
patent: 4774632 (1988-09-01), Neugebauer
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5093708 (1992-03-01), Solomon
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5122691 (1992-06-01), Balakrishnan
patent: 5217914 (1993-06-01), Matsumoto et al.
patent: 5265045 (1993-11-01), Nishio et al.
patent: 5346857 (1994-09-01), Scharr et al.
patent: 5377077 (1994-12-01), Burns
patent: 5399898 (1995-03-01), Rostoker
patent: 5454160 (1995-10-01), Nickel
patent: 5477067 (1995-12-01), Isomura et al.
patent: 5650977 (1997-07-01), Kyung et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 5869895 (1999-02-01), Raad
patent: 6150724 (2000-11-01), Wenzel et al.
patent: 6255736 (2001-07-01), Kaneko
patent: 253295 (1987-07-01), None
U.S. Appl. No. 148,857. Japan.
U.S. Appl No. 137,655. Japan.
U.S. Appl. No. 224,154. Japan.
U.S. Appl. No. 155,162. Japan.
U.S. Appl. No. 127, 856. Japan.
U.S. Appl. No. 117,252. Japan.
U.S. Appl. No. 117,251. Japan.
U.S. Appl. No. 117,146. Japan.
U.S. Appl. No. 248,541. Japan.
U.S. Appl. No. 216,455. Japan.
U.S. Appl. No. 99,362. Japan.
U.S. Appl. No. 42,942. Japan.
U.S. Appl. No. 35,546. Japan.
U.S. Appl. No. 269,352. Japan.
U.S. Appl. No. 90,959. Japan.
U.S. Appl. No. 90,957. Japan.
U.S. Appl. No. 90,937. Japan.
U.S. Appl. No. 304,655. Japan.
U.S. Appl. No. 283,149. Japan.
U.S. Appl. No. 84,741. Japan.
U.S. Appl. No. 61,029. Japan.
U.S. Appl. No. 50,551. Japan.
U.S. Appl. No. 278,893. Japan.
U.S. Appl. No. 207,562. Japan.
U.S. Appl. No. 129,955. Japan.
U.S. Appl. No. 62,069. Japan.
U.S. Appl. No. 5,540. Japan.
U.S. Appl. No. 5,455. Japan.
U.S. Appl. No. 276,751. Japan.
U.S. Appl. No. 276,750. Japan.
U.S. Appl. No. 266,454. Japan.
U.S. Appl. No. 231,450. Japan.
U.S. Appl. No. 173,170. Japan.
U.S. Appl. No. 169,062. Japan.
U.S. Appl. No. 69,150. Japan.
U.S. Appl. No. 44, 955. Japan.
U.S. Appl. No. 6,263. Japan.
U.S. Appl. No. 201,475. Japan.
U.S. Appl. No. 368,167. Japan.
U.S. Appl. No. 364,052. Japan.
U.S. Appl. 274,356. Japan.
U.S. Appl. No. 356,352. Japan.
U.S. Appl. No. 180,257. Japan.
U.S. Appl. No. 158,165. Japan.
U.S. Appl. No. 116, 861. Japan.
U.S. Appl. No. 76,946. Japan.
U.S. Appl. No. 62,961. Japan.
U.S. Appl. No. 61,152. Japan.
U.S. Appl. No. 48, 768. Japan.
U.S. Appl. 160,325. Japan.
U.S. Appl. No. 129,517. Japan.
U.S. Appl. No. 129,516. Japan.
U.S. Appl. No. 90,486. Japan.
U.S. Appl. No. 55,451. Japan.
U.S. Appl. No. 48,001. Japan.
U.S. Appl. No. 13,667. Japan.
U.S. Appl. No. 13,663. Japan.
U.S. Appl. No. 283,607. Japan.
U.S. Appl. No. 259,378. Japan.
U.S. Appl. No. 243,482. Japan.
U.S. Appl. No. 183,102. Japan.
U.S. Appl. No. 183,010. Japan.
U.S. Appl. No. 167,004. Japan.
U.S. Appl. No. 172,402. Japan.
U.S. Appl. No. 112,401. Japan.
U.S. Appl. No. 21,328. Japan.
U.S. Appl. No. 5,776. Japan.
U.S. Appl. No. 350,025. Japan.
U.S. Appl. No. 302,762. Japan.
U.S. Appl. No. 241,889. Japan.
U.S. Appl. No. 188,362. Japan.
U.S. Appl. No. 188,280. Japan.
U.S. Appl. No. 150,031. Japan.
U.S. Appl. No. 132,474. Japan.
U.S. Appl. No. 211,758. Japan.
U.S. Appl. No. 169,909. Japan.
U.S. Appl. No. 78,938. Japan.
U.S. Appl. No. 307,437. Japan.
U.S. Appl. No. 221,135. Japan.
U.S. Appl. No. 264,712. Japan.
U.S. Appl. No. 167,703. Japan.
U.S. Appl. No. 125,112. Japan.
U.S. Appl. No. 152,979. Japan.
U.S. Appl. No. 55,390. Japan.
U.S. Appl. No. 17,945. Japan.
U.S. Appl. No. 17,913. Japan.

Affiliated with

Also associated with

Rating

Stacked multi-component integrated circuit microprocessor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked multi-component integrated circuit microprocessor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked multi-component integrated circuit microprocessor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3570257