Stacked multi-chip semiconductor package improving...

Details Stacked multi-chip semiconductor package improving... Stacked multi-chip semiconductor package improving...

2006-10-10

2006-10-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S723000, C257S777000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07119425

ABSTRACT:
The chip package includes a first and second semiconductor chip. The first semiconductor chip has a first connection structure that electrically connects to a bond pad on a first surface of the first semiconductor chip. The second semiconductor chip has a second connection structure. The second connection structure is electrically connected to a bond pad on a first surface of the second semiconductor chip and extends through the second semiconductor chip to a second surface of the second semiconductor chip. A portion of the second connection structure extending to the second surface of the second semiconductor chip is electrically connected to the first connection structure and formed of a harder material than the first connection structure.

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