Stacked microelectronic assemblies and methods of making same

Details Stacked microelectronic assemblies and methods of making same Stacked microelectronic assemblies and methods of making same

2005-04-26

2005-04-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S685000, C257S686000, C257S697000, C439S058000, C439S067000, C439S068000

Reexamination Certificate

active

06885106

ABSTRACT:
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and second surfaces with conductive features exposed at the first surface and terminals exposed on the second surface. Preferably, the contact-bearing face of the first microelectronic element confronts the first surface of the dielectric with at least some of the conductive features being movable with respect to the contacts or terminals. By providing such movable features, joining units have heights of about 300 microns or less may be joined to the terminals thereby reducing the overall height of the microelectronic assembly to 1.2 mm and less.

REFERENCES:
patent: 4371744 (1983-02-01), Badet et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4558397 (1985-12-01), Olsson
patent: 4734825 (1988-03-01), Peterson
patent: 4754316 (1988-06-01), Reid
patent: 4761681 (1988-08-01), Reid
patent: 4841355 (1989-06-01), Parks
patent: 4868712 (1989-09-01), Woodman
patent: 4941033 (1990-07-01), Kishida
patent: 4956694 (1990-09-01), Eide
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4994902 (1991-02-01), Okahashi et al.
patent: 4996583 (1991-02-01), Hatada
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5117282 (1992-05-01), Salatino
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5247423 (1993-09-01), Lin et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5281852 (1994-01-01), Normington
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5313096 (1994-05-01), Eide
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5384689 (1995-01-01), Shen
patent: 5397916 (1995-03-01), Normington
patent: 5412247 (1995-05-01), Martin
patent: 5455740 (1995-10-01), Burns
patent: 5518964 (1996-05-01), Distefano et al.
patent: 5552631 (1996-09-01), McCormick
patent: 5552963 (1996-09-01), Burns
patent: 5585675 (1996-12-01), Knopf
patent: 5600541 (1997-02-01), Bone et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5637536 (1997-06-01), Val
patent: 5656856 (1997-08-01), Kweon
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5701031 (1997-12-01), Oguchi et al.
patent: 5708298 (1998-01-01), Masayuki et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5751063 (1998-05-01), Baba
patent: 5764486 (1998-06-01), Pendse
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5784264 (1998-07-01), Tanioka
patent: 5787581 (1998-08-01), Distefano et al.
patent: 5801072 (1998-09-01), Barber
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5835988 (1998-11-01), Ishii
patent: 5859472 (1999-01-01), Distefano et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5910685 (1999-06-01), Watanabe et al.
patent: 5915752 (1999-06-01), Distefano et al.
patent: 5976913 (1999-11-01), Distefano
patent: 5977618 (1999-11-01), Distefano et al.
patent: 6016254 (2000-01-01), Pfaff
patent: 6062879 (2000-05-01), Beaman et al.
patent: 6093029 (2000-07-01), Kwon et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6174172 (2001-01-01), Kazama
patent: 6180881 (2001-01-01), Isaak
patent: 6191368 (2001-02-01), Distefano et al.
patent: 6194291 (2001-02-01), DiStefano et al.
patent: 6195268 (2001-02-01), Eide
patent: 6218848 (2001-04-01), Hembree et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6228686 (2001-05-01), Smith et al.
patent: 6232152 (2001-05-01), Distefano et al.
patent: 6239496 (2001-05-01), Asada
patent: 6255727 (2001-07-01), Khoury
patent: 6268649 (2001-07-01), Corisis et al.
patent: 6274823 (2001-08-01), Khandros et al.
patent: 6291259 (2001-09-01), Chun
patent: 6303997 (2001-10-01), Lee
patent: 6313522 (2001-11-01), Akram et al.
patent: 6329607 (2001-12-01), Fjelstad et al.
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6369445 (2002-04-01), Khoury
patent: 6384475 (2002-05-01), Beroz et al.
patent: 6407456 (2002-06-01), Ball
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6476474 (2002-11-01), Hung
patent: 6499216 (2002-12-01), Fjelstad
patent: 6561819 (2003-05-01), Huang et al.
patent: 6573609 (2003-06-01), Fjelstad et al.
patent: 6657286 (2003-12-01), Light
patent: 6736665 (2004-05-01), Zhou et al.
patent: 52-075981 (1977-06-01), None
patent: 56-61151 (1981-05-01), None
patent: 57-31166 (1982-02-01), None
patent: 58-178529 (1983-10-01), None
patent: 60-194548 (1984-03-01), None
patent: 61-029140 (1986-02-01), None
patent: 61-101067 (1986-05-01), None
patent: 61-120454 (1986-06-01), None
patent: 61-137335 (1986-06-01), None
patent: 61-255046 (1986-11-01), None
patent: 63-18654 (1988-01-01), None
patent: 64-71162 (1989-03-01), None
patent: 5-144971 (1993-06-01), None
patent: 5-166994 (1993-07-01), None
“Megabyte Per Cubic Inch,” Defense Science, May 1988, p. 56.
“Three-Dimensional Packaging,” Defense Science, May 1988, p. 65.
U.S. Appl. No. 07/552,578, filed Jul. 13, 1990, Forthun.
U.S. Appl. No. PCT/US02/26805, filed Aug. 22, 2002, Mohammed.
U.S. Appl. No. 60/314,042, filed Aug. 22, 2001, Newsam.
U.S. Appl. No. 10/656,534, filed Sep. 5, 2003, Bang.
U.S. Appl. No. 09/776,356, filed Feb. 2, 2001.

Affiliated with

Also associated with

Rating

Stacked microelectronic assemblies and methods of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked microelectronic assemblies and methods of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked microelectronic assemblies and methods of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3367095