4. Active solid-state devices (e.g., transistors, solid-state diode
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Stackable electronic assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable flex circuit chip package and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate

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Stackable flex circuit IC package and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable flex circuit IC package and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reissue Patent

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Stackable heatsink structure for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Stackable heatsink structures for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Stackable integrated circuit package and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable integrated circuit package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable integrated circuit package system with recess

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Stackable integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable layer containing ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Stackable layer containing ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Stackable layers containing ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Stackable layers containing encapsulated integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Stackable lead frame package using exposed internal lead traces

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Stackable micropackages and stacked modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stackable molded packages and methods of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Stackable multi-chip package system with support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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