Stackable integrated circuit packaging

Details Stackable integrated circuit packaging Stackable integrated circuit packaging

2008-03-18

2008-03-18

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C228S180100

Reexamination Certificate

active

07345361

ABSTRACT:
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.

REFERENCES:
patent: 5040052 (1991-08-01), McDavid
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 7145225 (2006-12-01), Lee
patent: 2002/0135057 (2002-09-01), Kurita
patent: 2002/0196650 (2002-12-01), Chang

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