Stackable layer containing ball grid array package

Details Stackable layer containing ball grid array package Stackable layer containing ball grid array package

2007-07-10

2007-07-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S773000, C257S776000, C257S780000, C257S781000, C257S784000, C257SE23001

Reexamination Certificate

active

11229351

ABSTRACT:
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.

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