Stackable layers containing ball grid array packages

Details Stackable layers containing ball grid array packages Stackable layers containing ball grid array packages

2005-11-22

2005-11-22

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000, C257S758000

Reexamination Certificate

active

06967411

ABSTRACT:
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.

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